BUSINESS

CERTIFICATES / PATENTS

10-2302956 (flux application device)

10-2294635 (flux application device)

10-2280950 (Semiconductor package transfer device)

10-2225058 (Solder ball flux application device)

10-1831306 (Coil processing device)

10-1551803 (two-stage coil winding machine and two-stage coil winding method using the same)

10-1506663 (fluid supply device)

10-1416113 (product supply device)

10-1378590 (chip bonding device)

10-1279348 (LED package trimming device)

10-1279347 (Adhesive supply device)

10-1279346 (Adhesive application device)

10-1264264 (Semiconductor Package Handler)

10-1264250 (Semiconductor Package Handler)

10-1248143 (Image processing module and LED chip bonding device using the same)

ISO14001:2015

ISO/TS 16949:2009

ISO14001:2015 / KS I ISO 14001:2015

ISO9001:2015

ISO9001:2015 / KS Q ISO 9001:2015

유지보수관리

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