BUSINESS OVERVIEW TECHNOLOGY CERTIFICATES CERTIFICATES / PATENTS 10-2302956 (flux application device) 10-2294635 (flux application device) 10-2280950 (Semiconductor package transfer device) 10-2225058 (Solder ball flux application device) 10-1831306 (Coil processing device) 10-1551803 (two-stage coil winding machine and two-stage coil winding method using the same) 10-1506663 (fluid supply device) 10-1416113 (product supply device) 10-1378590 (chip bonding device) 10-1279348 (LED package trimming device) 10-1279347 (Adhesive supply device) 10-1279346 (Adhesive application device) 10-1264264 (Semiconductor Package Handler) 10-1264250 (Semiconductor Package Handler) 10-1248143 (Image processing module and LED chip bonding device using the same) ISO14001:2015 ISO/TS 16949:2009 ISO14001:2015 / KS I ISO 14001:2015 ISO9001:2015 ISO9001:2015 / KS Q ISO 9001:2015 유지보수관리