BUSINESS

TECHNOLOGY & SOLUTIONS

BUSINESS FIELD

AUTOMATION EQUIPMENT FOR
SEMICONDUCTOR PROCESSING


Development and manufacture of automation equipment for semiconductor processes, such as track equipment/RF probe stations, test handlers, and die bonders.

Development of own AI software equipment operation system.

Development of customized equipment for each customer’s mass-produced product.

Possesses self-development and manufacturing know-how for key components.

SUPPLY EQUIPMENT

TEST HANDLER : Bowl Feeder Test Handler / WLP Taping Machine

BONDER : Epoxy Die Bonder / FLIP Chip Die Bonder / Dipping FLIP Bonder(Sold Ball PKG)

PROBE MACHINE : Auto Wafer Probe Machine

INDUCTOR : Coil Mount / Coil Winding Machine

SCREEN PRINTER : Screen Printer

RF PROBE STATION

Overcoming the limitations of equipment that TSK and TEL companies occupy over 80% of.

Equipped with a multi-stage that measures two types of sawing die and wafer with one device.

Automatic diagnosis/compensation maintenance system

WLP TAPING & REEL

Accurate measurement, fast speed, improved process efficiency.

Die bonding technology / High-precision mechanical design know-how / Vision processing S/W design / Automation system design

IN-HOUSE DESIGN & MANUFACTURING

Self-development and manufacturing of core components and modules of equipment.

Can be reviewed starting from core parts based on customer requirements.

Expandability and technology supplementation for in-house development of new products.
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