[SUPER180] THERMISTER MOUNTER
General Specification
Index Time | 0.75 sec/pcs (2 Point Dotting) |
UPH | 4.800 ea/hour |
PKG | X-TAL |
Bonding Method | Solder |
Bonding Accuracy | ±40um Below / Theta : ±3º/td> |
Bonding Force | 50gf |
Material Size
PKG | 3225, 2520, 2016 |
Solder | Conductive Adhesive |
Dotting Size | ∅0.3 ~ 0.6 (Digital Control) |
Utility
Power | AC220V 50/60Hz 20A 1Φ |
Dimension | 1400(W) 1150(L) 17000(H) |
Weight | 1,100Kg |
Unit Specification
Rotate Table | Working Position : 16(Index) |
Bowl & Linear Feeder | PKG Supply |
Separator | PKG Pick Up Zone |
Pick Up Tool | Chip Pick Up Index Zone Loading and Unloading |
Rotation Pick Up Tool | Chip Pick Up Index Zone Unloading |
Align | PKG Align |
Camera | PKG Dotting Area Check and Bonding Check |
Test | PKG Testing (2Position) |
Solder | Solder Dotting Controlled |
Cassette | Thermistor Chip Supply |
Mount | Thermistor Chip Bonding |
Stage | Pallet Automatic Supply Method |
Elevator | Magazine Up/Down Controlled |
Magazine | Pallet Storage |
Purge | Index Sweeping |
End Sensor | Final Index Sensing |
Dispenser | Solder Dotting Size Controlled |