[SUPER120L] LED EPOXY DIE BONDER
General Specification
Index Time | 0.2 Sec /Cycle (90 Percent Rate of Operation) Chip size 250 * 250 standard |
Optics | Mount : Wafer & Lead frame recognition Epoxy : Lead frame Recognition ( 2 Camera ) |
Bonding Method | Epoxy Adhesive |
Chip Size | 0.15 ~ 2.0 mm |
Bonding Accuracy | X,Y : ±25um / Theta : ±3˚ |
Bonding Force | 10 gf ~ 200 gf digital control |
Material Size
Lead Frame | Width : 30 ~ 100mm |
Length : 600 ~ 734 mm | |
Thickness : 0.1 ~ 1.9 mm | |
Wafer size | 4 ~ 8 Inch |
Eject Pin | User specification |
Pick up collet | User specification |
Wafer ring | User specification |
Utility
Dimension | 3000(W) X1300(L)X 1970(H) ※H=Tower Lamp 480mm included |
Weight | 2,150kg |
Convenient function
Vision | Auto align function after Wafer change |
Wafer reverse insert detect function and align | |
Chip size auto teach & magnification auto calibration | |
Tool Change | One touch collet change method |
One touch eject needle change method |
Software future
Quality monitoring | Mount monitoring function to mount accuracy |
Post inspection function and graphic display | |
Software Function | Auto Mount level & pick up level teaching function |
Auto Eject level teaching function | |
Very erasable multi mount teaching by mouse | |
Mount speed auto calibration |