[SUPER170] FLIP CHIP BONDER
General Specification
| Index Time | 0.7 sec/chip(Including 0.1sec Process Time) |
| UPH | 5,100 ea/hour |
| Lead Frame | Horizontal Lead Frame Or Substrate |
| Bonding Method | Supersonic & Thermal Pressure Bonding |
| Chip Size | 0.1 ~ 2.0 mm |
| Bonding Accuracy | XY : ±5um |
| Bonding Force | 1N ~ 30N Digital Control |
Material Size
| Substrate | Width : 50~100mm |
| Magazine | Customer Specification |
| Wafer | 4 Inch |
Utility
| Power | AC220V 50/60Hz 1Φ |
| Dimension | 900(W) 1000(L) 1930(H) |
| Weight | 1,400Kg |
Unit Specification
| Loader | Substrate 3ea Supply |
| Feeder | Loading Using Linear Motor |
| Unloader | Magazine Vertical Drive |
| Wafer Stage | 4 Inch Wafer Expansion |
| Chip Recognition | 9ea Chip Mode |
| Pick up & Flip Head | Chip Pick Up Check By Vacuum |
| Nozzle Level Auto Detection | |
| Head | Bonding Force Controlled by Voice coil |
| One Touch Collect Switch Type | |
| Chip Pick Up Check By Vacuum | |
| Bonding Table | Substrate Absorption By Vacuum |
| Load Cell / Heater | |
| Eject | Sheet Absorption By Vacuum |
| Vision | 4ch Vision System |