[SUPER 120] EPOXY DIE BONDER
General Specification
| Index Time | 0.20 sec/cycle |
| UPH | 16.000 ea/hour |
| Lead Frame | Horizontal Lead Frame |
| Bonding Method | Epoxy Adhesive |
| Chip Size | 0.15 ~ 2.0 mm |
| Bonding Accuracy | ±25um / Theta : ±3˚ |
| Bonding Force | 25gf ~ 200gf Digital Control |
Material Size
| Lead Frame | Length : 100 ~ 280 mm |
| Width : 30 ~ 100mm | |
| Thickness : 0.1 ~ 1.9 mm | |
| Wafer | 4 ~ 8 Inch |
Utility
| Power | AC220V 50/60Hz 20A 1Φ |
| Dimension | 1460(W) 1000(L) 1750(H) |
| Weight | 1,750Kg |
Unit Specification
| Loader | Frame Automatic Supply Method(Magazine) |
| Feeder | Shaft Linear Motor Horizontal Drive(3Motor) |
| Chuck(Grip) L/F Clamp Method | |
| Rail Width Adjustable Type | |
| Unloader | Magazine |
| Wafer Stage | Adapt To Customer / Option : ⊝ |
| Chip Recognition | 9,3,1ea Chip Mode |
| Head | Bonding Force Controlled by Voice coil |
| One Touch Collect Switch Type | |
| Chip Pick Up Check By Vacuum | |
| Bonding Level Auto Detection | |
| Eject | Sheet Absorption By Vacuum |
| Vision | Wafer Vision : 0.5X ~ 3X Zoom, LED Lights Mount Vision : 0.5X ~ 3X Zoom, LED Lights |