[SUPER120L] LED EPOXY DIE BONDER
General Specification
| Index Time | 0.2 Sec /Cycle (90 Percent Rate of Operation) Chip size 250 * 250 standard |
| Optics | Mount : Wafer & Lead frame recognition Epoxy : Lead frame Recognition ( 2 Camera ) |
| Bonding Method | Epoxy Adhesive |
| Chip Size | 0.15 ~ 2.0 mm |
| Bonding Accuracy | X,Y : ±25um / Theta : ±3˚ |
| Bonding Force | 10 gf ~ 200 gf digital control |
Material Size
| Lead Frame | Width : 30 ~ 100mm |
| Length : 600 ~ 734 mm | |
| Thickness : 0.1 ~ 1.9 mm | |
| Wafer size | 4 ~ 8 Inch |
| Eject Pin | User specification |
| Pick up collet | User specification |
| Wafer ring | User specification |
Utility
| Dimension | 3000(W) X1300(L)X 1970(H) ※H=Tower Lamp 480mm included |
| Weight | 2,150kg |
Convenient function
| Vision | Auto align function after Wafer change |
| Wafer reverse insert detect function and align | |
| Chip size auto teach & magnification auto calibration | |
| Tool Change | One touch collet change method |
| One touch eject needle change method |
Software future
| Quality monitoring | Mount monitoring function to mount accuracy |
| Post inspection function and graphic display | |
| Software Function | Auto Mount level & pick up level teaching function |
| Auto Eject level teaching function | |
| Very erasable multi mount teaching by mouse | |
| Mount speed auto calibration |