[SUPER 150] BLANK MOUNTER
General Specification
| Index Time | 0.70 sec/pcs (2 Point Dotting) |
| UPH | 5.100 ea/hour |
| PKG | X-TAL |
| Bonding Method | Epoxy |
| Bonding Accuracy | 0.15 ~ 2.0 mm |
| Bonding Accuracy | ±25um / Theta : ±2 |
| Bonding Force | 30gf |
Material Size
| PKG | 3225, 2520, 2016, 1612 |
| Epoxy | Conductive Adhesive |
| Dotting Size | ∅0.15 ~ 0.5 (Digital Control) |
Utility
| Power | AC220V 50/60Hz 20A 1Φ |
| Dimension | 1240(W) 1290(L) 17500(H) |
| Weight | 1,100Kg |
Unit Specification
| Rotate Table | Working Position : 16(Index) |
| Stage | Tray And Pallet Automatic Supply Method |
| Rotation Pick Up Tool | Chip Pick Up Index Zone Loading and Unloading |
| Align | PKG Align |
| Inspection Laser | PKG Dotting Height Check |
| Camera | PKG Dotting Area Check and Bonding Check |
| Mount | Blank Chip Bonding |
| Epoxy | Epoxy Dotting Controlled(2Position) |
| Elevator | Magazine Up/Down Controlled |
| Mount | Chip Pick Up Check By Vacuum |
| Magazine | Tray And Pallet Storage |
| End Sensor | Final Index Sensing |
| Dispenser | Epoxy Dotting Size Controlled |