[SUPER180] THERMISTER MOUNTER
General Specification
| Index Time | 0.75 sec/pcs (2 Point Dotting) |
| UPH | 4.800 ea/hour |
| PKG | X-TAL |
| Bonding Method | Solder |
| Bonding Accuracy | ±40um Below / Theta : ±3º/td> |
| Bonding Force | 50gf |
Material Size
| PKG | 3225, 2520, 2016 |
| Solder | Conductive Adhesive |
| Dotting Size | ∅0.3 ~ 0.6 (Digital Control) |
Utility
| Power | AC220V 50/60Hz 20A 1Φ |
| Dimension | 1400(W) 1150(L) 17000(H) |
| Weight | 1,100Kg |
Unit Specification
| Rotate Table | Working Position : 16(Index) |
| Bowl & Linear Feeder | PKG Supply |
| Separator | PKG Pick Up Zone |
| Pick Up Tool | Chip Pick Up Index Zone Loading and Unloading |
| Rotation Pick Up Tool | Chip Pick Up Index Zone Unloading |
| Align | PKG Align |
| Camera | PKG Dotting Area Check and Bonding Check |
| Test | PKG Testing (2Position) |
| Solder | Solder Dotting Controlled |
| Cassette | Thermistor Chip Supply |
| Mount | Thermistor Chip Bonding |
| Stage | Pallet Automatic Supply Method |
| Elevator | Magazine Up/Down Controlled |
| Magazine | Pallet Storage |
| Purge | Index Sweeping |
| End Sensor | Final Index Sensing |
| Dispenser | Solder Dotting Size Controlled |