[SUPER140] COB DIE BONDER (SINGLE)
General Specification
| Index Time | 0.2 sec/cycle |
| UPH | 16.000 ea/hour |
| Lead Frame | Horizontal Lead Frame or PCB |
| Bonding Method | Epoxy Adhesive |
| Chip Size | 0.15 ~ 2.0 mm |
| Bonding Accuracy | ±35um / Theta : ±5˚ |
| Bonding Force | 40gf ~ 200gf Digital Control |
Material Size
| Lead Frame & PCB | Width : Max 145mm |
| Length : Max 250mm | |
| Thickness : 0.1 ~ 1.9 mm | |
| Wafer Size | Ring Size 6 Inch (Double Ring Type) Wafer Working Area 4 Inch |
Specifications By Unit
| Mount Table | X-Y Table Driving Method |
| Epoxy Unit | One Head Epoxy Stamping One Epoxy Disk & Rotary Head Stamp One Camera Vision Align Method |
| Mount Vision Unit | Optics : Adjust Magnification By Zoom |
| Wafer & Wafer Vision | Double Ring Loading Method 9EA, 3EA, 1EA Chip Recognition Method Wafer Manual Change |
| Head Unit | Bonding Force Control By Voice Coil Vacuum Pick Up Miss Detection Mount & Pick Up Levels Auto Teach |
| Eject Unit | Vacuum Sheet Suction One Eject Needle Method |
Utility
| Vacuum | Above -60㎪ |
| Air | Above 0.4 ~ 0.5㎫ |
| Power | AC 220V +/-10%, 50/60Hz, 20A, 1Φ |
Etc
| Color | Company Standard Color |
| Dimensions | 980(W) × 960(L) × 1980(H) |
| Machine Weight | 1,000kg |