[SUPER100] HOOP DIE BONDER
General Specification
| Index Time | 0.18 sec/cycle |
| UPH | 18.000 ea/hour |
| Lead Frame | Hoop Frame |
| Bonding Method | Eutectic |
| Chip Size | 0.15 ~ 2.0 mm |
| Bonding Accuracy | ±35um / Theta : ±3˚ |
| Bonding Force | 25gf ~ 200gf Digital Control |
Material Size
| Lead Frame | Width : 21 ~ 75mm |
| Thickness : 0.1 ~ 1.9 mm | |
| Magazine | Stroke M/Z Link Type |
| Wafer | 4 ~ 8 Inch |
Utility
| Power | AC220V 50/60Hz 20A 1Φ |
| Dimension | 1920(W) 1000(L) 1750(H) Not Included Tower Lamp |
| Weight | 1,000Kg |
Unit Specification
| Loader Real | Real Frame Automatic Supply Method |
| Feeder | Servo Roller Feeding Method |
| Heating Temp : ~ 500℃ | |
| 3 Heating Zone(Pre, Mount, Cooling) | |
| Unloader | Magazine |
| Wafer Stage | Adapt To Customer / Option : ⊝ |
| Chip Recognition | 9,3,1ea Chip Mode |
| Head | Bonding Force Controlled by Voice coil |
| One Touch Collect Switch Type | |
| Chip Pick Up Check By Vacuum | |
| Bonding Level Auto Detection | |
| Eject | Sheet Absorption By Vacuum |
| Vision | Wafer Vision : 0.5X ~ 3X Zoom, LED Lights Mount Vision : Magnification Fix Method |