ABOUT SFE
COMPANY HISTORY
< 2024
- Signed a technology transfer MOU with Japan's Apollowave.
< 2023
- Development of high-performance RF filter Auto Wafer Probe.
< 2022
- Received the $30 million Export Tower award.
< 2021
- Development of Auto Wafer Probe equipment.
< 2020
- Development of Dipping Bonder (UPH:15000EA).
< 2019
- Development of WLP (Wafer Level Package).
< 2018
- Development and mass production of Wave Guide Filter Tuning Machine.
- Development of Tape Jig Bonder.
- Development of 5G Cavity Filter Tuning Machine.
< 2017
- Development and mass production of the MF testing machine.
- Development of cavity filter auto-tuning machine.
< 2016
- Applied for a patent.
- Developed a coil mount.
< 2015
- Selected as a regional hidden champion.
- Applied for four patents. (including No. 10-1495300)
- Developed an auto coil winding machine.
< 2014
- Awarded with the USD 3 Million Export Tower.
- Applied for three patents. (including No. 10-1378590)
< 2013
- Applied for Eight patents. (including No. 10-1242005).
- Developed a flip-chip bonder.
- Acquired the ISO/TS 16949 certification.
- Awarded with the USD 1 Million Export Tower.
< 2012
- Launched the Plating Division.
- Developed a screen printer.
< 2011
- Founded the R&D Center.
- Acquired the ISO 9001, 14001 certifications.
< 2010
- Established a corporation in China(SFE SUZHOU CO., LTD).
- Supplied 200 LED die bonders.
< 2009
- Founded SFE Co., Ltd. Launched the Equipment Business Division.
- Developed an LED die bonder and a test handler.